STRUCTURAL TEST ICT
Due to the high complexity of current printed circuit boards, the Structural Test ICT ( In-Circuit Test ) has proven to be a great ally to maximize test coverage , enabling excellence in manufacturing, continuous and instantaneous feedbacks , traceability and integration with Shopfloor Control .
Technical Characteristics
Raise the Test Coverage , with a balance between Detection and Diagnosis.
Check the electrical operation of some circuits and components.
Perform all parametric ( unpowered ) tests of an MDA ( Opens , Shorts , Parts , IC Clamping Diode and IC Open / TestJet ).
Powered tests, simulating the Power Sequence of each board.
Digital Tests (Logical Ports, Mux, Memories, among others).
Analog Functional Tests (operational amplifiers, crystals, oscillators, AD/DA converters, voltage regulators, among others).
ETS Differentials
Specialized team focused on Co-Building a test solution.
Support for Design Review , aligned with your production process, from prior analysis of Test Coverage to implementation and production monitoring.
Strain Gage certification ( Mechanical Stress analysis), to ensure the integrity of your board in this test step.
Development for major global platforms such as TRI (5001 and 8100) and KeySight (i3070)
Own equipment for debugging, drilling and making special parts.
Coverage of Revealed and REAL PPVS Tests - TCR 4.0
