1. Powerful Software Environment

• MS-Windows Version system software, friendly user interface designed
• Auto-Learning and Automatic Program Generation of Open/Short, Pin Information, IC Clamping Diode, TestJet Technology, DiodeCheck...
• Automatic Guarding points selection Built in System Self-Diagnostic function Practical quality management and statistic report available
• Networking available
• BoardView function can allocate defect device and pin instantly

2. Comprehensive Hardware Structure Design

• Advanced durable REED Relay Switching design, high guarding ratio
• Programmable Open/Short measurement Threshold setup
• SPS Power On function test expandable
• Test interface available in Press Type, Vacuum Type and Off-Line, In-Line
• High capacity rack design, test points up to 2560
• Auto-Alignment function expandable
• Multiple Safety Protection design

3. Advanced Testing Tecnologies Integration

• TestJet Technology, the best solution to cover most SMT IC lead soldering defect
• With IC Clamping Diode test technologies, can enhance the testing coverage of BGA package
• Alternative learning module can automatically generate IC Reverse Check program
• Leakage current measurement is able to detect polarity of Capacitor
• Complete optional modules include, Frequency measurement, Voltage measurement, Current measurement, NandTree Test, Boundary Scan Test
• 1MHz AC signal for testing small Capacitor and Inductor
• Transistor, FET, SCR, and Photo Coupler testing mode available
• Pin Contact Check capability

select TR518FE TR518FR TR518F TR5001 TR8001