1. Powerful Software Environment

• MS-Windows Version system software, friendly
  user interface designed
• Auto-Learning and Automatic Program Generation of Open/Short, Pin Information, IC
  Clamping Diode, TestJet Technology...
• Automatic Guarding points selection
• Built in System Self-Diagnostic function
• Practical quality management and statistic report available
• Networking available
• BoardView function can allocate defect device and pin instantly

2. Comprehensive Hardware Structure Design

• High-End semiconductor CMOS Switching design, permitting no life limitation concern
• Test interface available in Press Type, Vacuum Type and Off-Line, In-Line
• High capacity rack design, test points up to 3584
• Auto-Alignment function expandable
• Multiple Safety Protection design

3. Advanced Testing technologies Integration

• TestJet Technology, the best solution to cover most SMT IC lead soldering defect
• With IC Clamping Diode test can enhance the testing coverage of BGA package
• Alternative learning module can automatically generate IC Reverse Check program
• Leakage current measurement is able to detect polarity of Capacitor
• Complete optional modules include, Frequency measurement, Voltage measurement, Current measurement
• 1MHz AC signal for testing small Capacitor and Inductor
• Transistor, FET, SCR, and Photo Coupler testing mode available
• Pin Contact Check capability