Solder Paste Inspection System
The quality at the start of the SMT process comes from how to improve the quality of solder paste printing. The TR7006 three dimensional solder paste tester can quickly detect the thickness of every solder joint and any open or short circuits, solving the long existed problem which two dimensional testing cannot solve. It targets tiny products, preventing them from bad connections as a result from small solder joints, lack of solder, component vibrations and heat expansions, improving the products quality and productivity.  
TR7006 Comprehensive Features:
# Ultra High Speed
# Identify Solder Paste Defects Immediately
# Fast, Easy Programming
# Provide Statistical Process Control Output

# 100% In-Line solder Paste Inspection
• TR7006 in-line solder paste inspection system
• Incorporates the leading-edge TRI-Laser speed scan system
• Unmatched resolution, repeatability and accuracy

# Industry's Fastest 3D Laser Scanning
• Full 3D scan at 71cm2/sec (11in2/sec), 20£gm (optical resolution)
• Inspection PC-ATX board (300mm x 210mm) in less than 30 sec
• Repeatable and accurate results even on small CSP and 0201
• 8X programmable resolution range from 10 to 80£gm meets the requirements for fine pitch PCBA and speed critical applications
• Both 2D and 3D height images are available at run time for defect review and inspection program editing

# 3D Solder Paste Inspection
• Reliable IC lead bridge detection by using high performance programmable RGB lighting for background image noise elimination
• New lifted IC lead, insufficient/excess solder detection algorithm for reliable detection and low false alarm

# The Inspection of the Bridge of the Solder
• The inspection of the height, area and volume of the solder
• Users can define the ranges for the height, area and volume of the solder